Advantages of fully automatic high-speed dispensing machine:

(1) High performance, low cost, automatic batch detection of dispensing effects, and interception of defects.

(2) Non contact dispensing without the need for Z-axis up and down movement, increasing production capacity.

(3) Accurate glue control and precise visual algorithms have improved the yield of dispensing operations.

(4) Upgradable automated dispensing control platform facilitates configuration changes to meet product diversification and improvement needs.

(5) Integrated rack design, stable structure, longer system operation, shorter downtime, and higher efficiency.

The application scope of fully automatic high-speed dispensing machine:

LCD COG Coating, LCD Sealant Coating

LCD conductive silver glue dots, chip bottom filling

COB packaging, conductive adhesive coating

PCB board coating LED packaging

LED lighting sealing LED thermal conductive adhesive coating

FPC component reinforcement

Gluing for the electroacoustic industry, optical lenses, mobile phone cameras, inductors and resistors, semiconductor and microelectronics packaging, automotive components, solar junction boxes, medical consumables, simple assembly, etc

The main parameters of the fully automatic high-speed dispensing machine are: