Main functions:

1. Suitable for optical detection before wafer cutting;

2. Automatic AOI detection, with no human contact throughout the process;

3. Compatible with SEMI standard 100-150mm (4-6 inches)/150-200mm (6-8 inches) Bare Wafer;

4. Compatible with SEMI standard H-Cassette;

5. Field of view FOV15 * 15mm @ 0.75x, automatically adjustable magnification;

6. Support row/column/rectangular area checking;

7. Support AOI detection for scratches, ink leaks, oil stains, dirt, cracks, ink spots, and chipping edges;

8. Support SECS/GEM communication;

9. Global wafer MAP/Review function;

10. The film transmission mechanism is modular and can be used independently;