Main functions:

1. Suitable for optical detection before wafer cutting;

2. Automatically retrieve Wafer from CST, Mapping，Pre-aliner， Macroscopic inspection, feeding to semi-automatic manual table;

3. Wafer: 2 "wafer with a diameter of 50mm; 4”wafer   φ100mm， Thickness: 300-1100 μ m, warping ＜ 0.5mm; Crystal round box: 2 "and 4" 25 slot Cassette;

4. Compatible with SEMI standard H-Cassette;

5. Conduct visual inspection with a microscope and manually adjust the magnification;

6. The manual table is adjustable on both XY axes;

7. Support AOI detection for scratches, ink leaks, oil stains, dirt, cracks, ink spots, and chipping edges;

8. Support SECS/GEM communication;

9. The film transmission mechanism is modular and can be used independently;