main features 

1. Applicable wafer specifications: 4 inches -6 inches -8 inches;

2. Dual arm transmission method;

3. The wafer fixing methods include vacuum adsorption, lower support, and edge clamping, with optional methods available;

4. The fork can be made of ceramic, carbon fiber, aluminum alloy, and other materials to choose from;

5. Control adopts positive motion control mode;

6. Modular design, compatible with various machine configurations;

7. Additional running axes can be added as needed;

8. Automatic Mapping function can be added to the fork;

9. Operation safety protection alarm;

10. Closed working environment;

11. Passed SEMI S2 certification;