Main functions:

1. Suitable for edge collapse and crack detection on wafers;

2. Compatible with 6-8 inch wafers;

3. It can automatically load and unload materials and read the Wafer ID;

4. Possess AI algorithms that can correctly recognize and output results;

5. Can perform edge collapse and crack detection on both sides;

6. Wafer Pre Aligner module;

7.6-8-inch wafer handling robot arm;

8. OCR module unit;

9. Motion control system;